2026 CEEC Entrepreneurship Research and Pedagogy Conference Submission Guidelines

We are pleased to invite submissions for the 2026 CEEC Entrepreneurship Research and Pedagogy Conference, organized by the Lavin Entrepreneurship Center at San Diego State University (SDSU). The conference will take place from April 15 to April 18, 2026, on the SDSU campus in San Diego.

Submission Categories (applies to both deadlines)

A. Research Presentations (extended abstract, 750–1,000 words)
For empirical or conceptual research on entrepreneurship (e.g., ecosystems, inclusive entrepreneurship, venture-creation processes, entrepreneurship enablers/barriers, etc.).
Include: purpose/theory, methods/data, key or anticipated findings, contribution, and implications for practice.

B. Pedagogical Innovations & Experiential Programs (extended abstract, 750–1,000 words)
For teaching innovations and experiential programs (e.g., accelerator/incubator courses, community-engaged projects, AI tools for entrepreneurs, venture mentoring, pitch/seed-fund designs, micro-internships).
Include: context/objectives, design, implementation, evidence of impact (learning outcomes, adoption, assessment), and transferability.

C. Roundtable Discussions (brief proposal, 400–600 words)
For discussions led by educators, practitioners, and scholars on research methods, teaching practices, and experiential program design and assessment.  
Include: focal question(s), brief background or exemplar, 2–3 discussion prompts, intended audience. Please also specify if this would be a hands-on session.

Note: Categories A and B are scheduled in Presentation Sessions (Nov 14, 2025 submission deadline). Category C is scheduled in Roundtable Sessions (Feb 27, 2026 submission deadline). All three categories welcome both research-focused and pedagogy/experiential-focused contributions.

If you require a visa to travel to the U.S., please submit your abstract/proposal by Friday, November 14, 2025, to allow sufficient time for your visa-appointment scheduling and processing.